At the exit of the snout bore, thick epoxy is applied to the fibre to cover the external fibre ferrule to the harness, cladding overlay and fibre cladding. Upon assembly, the ferrules are soldered to the casing wall and snout bore by applying a series of solder joint seals. The butterfly casing interface wall has a snout with a concentric hole bored to fit the ferrules on the fibre. The fibre is constructed with a ferrule interface, which is gold plated and pre-coated with solder. In the scheme of packaging, the fibre has to be interfaced to a package casing, commonly designed as a “butterfly” package. These methods will fix the end tip of an optical fibre to a sub-mount or substrate near the laser diode. Current methods of laser fibre interface demand that the fibres be fixed to the laser diodes' emitter facets by a compliant clip restraining V groove. The trends in delivering laser light into fibres for more efficient connectivity will put cost of packaging as the primary consideration for packaging laser diodes. The proliferation of laser diodes in the areas of optical networking, medical and spectroscopic instruments have placed greater demands on the way laser diodes are packaged and interfaced to fibre. G02B6/4248- Feed-through connections for the hermetical passage of fibres through a package wall.shape, construction, internal or external details G02B6/42- Coupling light guides with opto-electronic elements.G02B6/00- Light guides Structural details of arrangements comprising light guides and other optical elements, e.g.G02B- OPTICAL ELEMENTS, SYSTEMS OR APPARATUS.Assignors: CHONG, POH LIN, LAM, YEE LOY, TEO, KIAN HIN VICTOR Publication of US20030133673A1 publication Critical patent/US20030133673A1/en Application granted granted Critical Publication of US6814500B2 publication Critical patent/US6814500B2/en Adjusted expiration legal-status Critical Status Expired - Fee Related legal-status Critical Current Links Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Priority claimed from GB0128619 external-priority Application filed by DenseLight Semiconductors Pte Ltd filed Critical DenseLight Semiconductors Pte Ltd Assigned to DENSELIGHT SEMICONDUCTOR PTE LTD reassignment DENSELIGHT SEMICONDUCTOR PTE LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Original Assignee DenseLight Semiconductors Pte Ltd Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) ( en Inventor Yee Loy Lam Kian Hin Victor Teo Poh Lin Chong Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Expired - Fee Related, expires Application number US10/305,742 Other versions US20030133673A1 Google Patents Optical interface utilizing polymer assisted strain reliefĭownload PDF Info Publication number US6814500B2 US6814500B2 US10/305,742 US30574202A US6814500B2 US 6814500 B2 US6814500 B2 US 6814500B2 US 30574202 A US30574202 A US 30574202A US 6814500 B2 US6814500 B2 US 6814500B2 Authority US United States Prior art keywords jacket fibre moulded snout bore Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents US6814500B2 - Optical interface utilizing polymer assisted strain relief US6814500B2 - Optical interface utilizing polymer assisted strain relief
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